Amber C. Abare Inventions, Patents and Patent Applications (2024)

  • LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    Publication number: 20210119090

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Application

    Filed: December 9, 2020

    Publication date: April 22, 2021

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10964858

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: April 10, 2019

    Date of Patent: March 30, 2021

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10930826

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: April 10, 2019

    Date of Patent: February 23, 2021

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10897000

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: April 10, 2019

    Date of Patent: January 19, 2021

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10879435

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: February 21, 2020

    Date of Patent: December 29, 2020

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10707386

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: April 10, 2019

    Date of Patent: July 7, 2020

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    Publication number: 20200194636

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Application

    Filed: February 21, 2020

    Publication date: June 18, 2020

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitter packages, systems, and methods having improved performance

    Patent number: 10439112

    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.

    Type: Grant

    Filed: July 20, 2012

    Date of Patent: October 8, 2019

    Assignee: Cree, Inc.

    Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins

  • LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    Publication number: 20190237638

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Application

    Filed: April 10, 2019

    Publication date: August 1, 2019

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitting diodes, components and related methods

    Patent number: 10290777

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Grant

    Filed: July 21, 2017

    Date of Patent: May 14, 2019

    Assignee: CREE, INC.

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS

    Publication number: 20180033924

    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Type: Application

    Filed: July 21, 2017

    Publication date: February 1, 2018

    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare

  • Light emitter packages, systems, and methods

    Patent number: 9349929

    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

    Type: Grant

    Filed: December 13, 2012

    Date of Patent: May 24, 2016

    Assignee: Cree, Inc.

    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado, Michael Bergmann

  • LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS

    Publication number: 20160013164

    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.

    Type: Application

    Filed: April 6, 2015

    Publication date: January 14, 2016

    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo

  • High density multi-chip LED devices

    Patent number: 9041042

    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    Type: Grant

    Filed: January 31, 2011

    Date of Patent: May 26, 2015

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt

  • Light emitter devices

    Patent number: 9000470

    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.

    Type: Grant

    Filed: January 30, 2014

    Date of Patent: April 7, 2015

    Assignee: Cree, Inc.

    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo

  • HIGH DENSITY MULTI-CHIP LED DEVICES

    Publication number: 20150048393

    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    Type: Application

    Filed: November 3, 2014

    Publication date: February 19, 2015

    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt

  • High density multi-chip LED devices

    Patent number: 8896013

    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    Type: Grant

    Filed: January 31, 2011

    Date of Patent: November 25, 2014

    Assignee: Cree, Inc.

    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt

  • LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS

    Publication number: 20140217433

    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.

    Type: Application

    Filed: January 30, 2014

    Publication date: August 7, 2014

    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo

  • Light emitting diode (LED) package

    Patent number: D709464

    Type: Grant

    Filed: May 31, 2012

    Date of Patent: July 22, 2014

    Assignee: Cree, Inc.

    Inventors: Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani

  • Light emitting diode (LED) package

    Patent number: D749051

    Type: Grant

    Filed: December 13, 2012

    Date of Patent: February 9, 2016

    Assignee: Cree, Inc.

    Inventors: Joseph G Clark, Amber C Abare, David T Emerson, Jeremy S Nevins, Raymond Rosado

Amber C. Abare Inventions, Patents and Patent Applications (2024)
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